Product Dimensions-T9110

Date: Apr 23, 2025 Views: 889

　　A typical controller arrangement is shown with processor modules installed on the processor base unit and an I/O base unit mated with the processor base unit. I/O modules are installed on the base unit and a termination assembly plugged into the I/O base unit.

　　The depth of the base unit (18 mm) excludes the parts of the backplane connectors that mate inside the module connectors. Adding the depth of a module (118 mm) to the depth of the base unit gives the overall depth of the controller assembly at 136 mm.

　　Compact Module Design

　　Each processor and I/O module has a flame-retardant and impact-resistant plastic cover. The coveris designed to help ventilation and heat dissipation occur naturally without the need forfan assisted cooling. Processor and I/O modules fit onto standardized base units. Base units plug together by side connectors and are securely held in position by specially designed plastic clips which cannot corrode or seize up. Modules are retained by a locking screw which is easy to access from the front.

　　Module Polarization Keying

　　For each I/O Module there is a matched termination assembly. The controller incorporates module polarization keying to make sure that they are correctly mated when installed. Sockets on the rear end plate align and mate with coding pins found on the termination assembly. The alignment of the sockets and pins make sure that only the matched I/O modules and termination assemblies can be mated.

　　Module Locking Mechanism

　　Each module carries a locking mechanism, which secures the module onto its base unit. The locking mechanism is in the form of a clamp screw, which can be seen on the front panel of the module and engaged by a quarter turn of a flat blade screwdriver. The module senses the locking mechanism position and notifies the controller accordingly. This acts as an interlock device and helps prevent the module from going on-line when it is not in the locked position.

　　Field Wiring

　　Field device wiring connections are made to industry-standard screw terminal blocks on the termination assemblies. Terminals are easy to access without needing to dismantle assemblies. The specification for the field wiring sizes is given in the topic "Power and External Connector Wiring Requirements".

　　This illustration shows field wiring connections at the termination assemblies.

　　External Ethernet, Serial Data and Power Connections

　　The processor base unit external connections are:

　　• Earthing Stud

　　• Ethernet Ports (E1-1 to E3-2)

　　• Serial Ports (S1-1 to S3-2)

　　• Redundant +24 Vdc powers supply (PWR-1 and PWR-2)

　　• Program Enable security key (KEY)

　　• The FLT connector (currently not used).

　　The power connections supply all three modules with redundant power, each processor module each have two Serial ports and two Ethernet port connectors. The KEY connector supports all three processor modules and helps prevent access to the application unless the Program Enable key is inserted.

　　Serial Communications Ports

　　The serial ports (S1-1 and S1-2; S2-1 and S2-2; S3-1 and S3-2) support the following signal modes depending on use:

　　• RS485fd: A four-wire full duplex connection that features different busses for transmit and receive. This selection must also be used when the controlleris acting as a MODBUS Master using the optional fourwire definition specified in Section 3.3.3 of the MODBUS-over-serial standard.

　　• RS485fdmux: A four-wire full-duplex connection with tri-state outputs on the transmit connections. This must be used when the controller is acting as a MODBUS Slave on a four-wire bus.

　　• RS485hdmux: A two-wire half duplex connection applicable for master slave or slave use. This is shown in the MODBUS-over-serial standard.

　　Processor Back-up Battery

　　The T9110 processor module has a back-up battery that powers its internal Real Time Clock (RTC) and a part of the volatile memory (RAM). The battery only supplies power when the processor module is no longer powered from the system power supplies. The specific functions that the battery maintains on complete loss of power are:

　　• Real Time Clock - The battery supplies power to the RTC chip itself.

　　• Retained Variables - Data for retained variables is stored at the end of each application scan in a portion of RAM, backed up by the battery. On restoration of power' the retained data is loaded back into the variables assigned as retained variables for use by the application.

　　• Diagnostic logs - The processor diagnostic logs are stored in the portion of RAM backed by the battery

　　• Real Time Clock - The battery supplies power to the RTC chip itself. • Retained Variables - Data for retained variables is stored at the end of each application scan in a portion of RAM, backed up by the battery. On restoration of power' the retained data is loaded back into the variables assigned as retained variables for use by the application.

　　• Diagnostic logs - The processor diagnostic logs are stored in the portion of RAM backed by the battery.

　　The battery has a design life of 10 years when the processor module is continually powered; for processor modules that are un-powered, the design life is up to 6 months. Battery design life is based on operating at a constant 25°C and low humidity. High humidity, temperature and frequent power cycles will shorten the operational life of the battery

　　Low Battery Alarm

　　A variable in the AADvance Workbench software or AADvance-Trusted SIS Workstation software can be set up and report the battery status. It will give an alarm and set a warning light on the processor front panel when the battery voltage is low.

　　Disabling the Low Battery Alarm

　　For applications that do not require Real Time Clock functionality, or there are specific constraints, for example, the controlleris in an inaccessible location, that make it necessary to remove the battery when the system is installed and set up, the battery failure alarm can be disabled from AADvance Workbench software or AADvance-Trusted SIS Workstation software.

　　Battery Location

　　The battery is supplied separately and inserted into a slot behind a removable cover on the front panel of the processor module. The battery position is shown in the illustration:

　　Battery Specification

　　A Polycarbon monofluoride Lithium Coin Battery with a nominal voltage of 3V; Nominal capacity (mAh) 190; Continuous standard load (mA) 0.03; Operating temperature range -30ºC to +80ºC, manufactured by Panasonic.

　　Processor Maintenance Socket

　　Behind the removable cover on the processor front panel is a maintenance socket SK1. This socket is for maintenance use only.Behind the removable cover on the processor front panel is a maintenance socket SK1. This socket is for maintenance use only.

　　I/O Base Unit

　　An I/O base unit holds up to three I/O modules:

　　Termination Assemblies

　　The AADvance system provides a range of termination assemblies to connect field wiring to the I/O modules. A termination assembly is a printed circuit equipped with screw terminal blocks forthe field wiring (and in some cases fuses) and connectors forthe plug-in I/O modules. Termination assemblies give the system designerflexibility when configuring redundant and fault tolerant systems.

　　Termination assemblies come in three types: simplex, dual or triple to accommodate one two or three I/O modules. Each termination assembly provides connections for up to 16 channels but can accommodate 8 or 16 channel modules.

　　The version illustrated is a simplex termination assembly for a digital input module. The field wiring connectors are located to the left, the fuses have a cover (shown open) and the module sockets are to the right. Each fuse cover has a label that identifies the fuse numbers.

　　The T9892 Terminal Assembly module operates in conjunction with the T9451 Digital Output Module and provides 8 dual configuration output channels. It shares the same pin-out as the standard AADvance T9852 Digital Output Terminal Assembly and has the same coding peg configuration. The difference is that the T9892 has a separate connector for the field power input voltage connections (the left most terminal block shown below). It also has additional fusing to give extra protection against field faults.

　　Backplane Electrical Ratings

　　To comply with UL/CSA standards use the following voltage and current ratings for the Processor and I/O Backplanes when designing your power distribution:

　　Table 5 - Maximum Electrical Rating Values Module Back-plane Electrical Ratings Input/Output Electrical Ratings Voltage Range (Vdc) Maximum Current (mA) T9100 18-32 10.4A (400 mA per slot) - T9300 18-32 9.6A (400 mA per slot) - T9110 18-32 380 - T9401 18-32 260 Input: 18-32 Vdc @ 24 mA T9402 18-32 260 Input: 0-32 Vdc @ 6.5 mA T9431 18-32 260 Input: 0-32 Vdc @ 6.5 mA T9432 18-32 260 Input: 18-32 Vdc @ 24 mA T9481 18-32 260 Output: 18-32 Vdc/0-20 mA T9482 18-32 260 Output: 18-32 Vdc/0-20 mA T9451 18-32 165 Output: 18-32 Vdc @ 0.5 A, Pilot duty 16 VA, 1.5 A Inrush T9801 18-32 6.5 - T9802 18-32 6.5 - T9803 18-32 6.5 - T9831 18-32 0-24 - T9832 18-32 0-24 - T9833 18-32 0-24 - T9851 18-32 500 - T9852 18-32 500 - T9892 18-32 500 - T9881 18-32 0-24 - T9882 18-32 0-24 -

　　Technical Features Controller Internal Bus Structure

　　Internal communication between the processor modules and I/O modules is supported by command and response busses that are routed across the processor and I/O base units.

　　The processor modules acts like a communications master, sending commands to its I/O modules and processing their returned responses. The two command busses I/O Bus 1 and I/O Bus 2 take the commands from the processor to the I/O modules on a multi-drop basis. An inter-processor link (IPL) supplies the communication links between dual or triple processor modules.

　　Each I/O module has a dedicated response line which returns to the processor. The unique response line for each I/O module supplies an unambiguous identification of the source of the I/O data and assists with fault containment.

　　Internal Diagnostics and Fault Reset

　　The AADvance controller contains comprehensive internal diagnostic systems to identify faults that occur during operation and trigger warnings and status indications. The diagnostic systems run automatically and test the system for faults related to the controller, and field faults related to field I/O circuits. Serious problems are reported immediately, but faults that are not on noncritical items are filtered to help prevent spurious alarms. The diagnostic systems monitor such items atregulartimes, and need a number of occurrences of a possible fault before reporting it as a problem.

　　The diagnostic systems use simple LED status indications to report a problem. The LED indications identify the module and can also identify the channel where the fault has occurred. There is also a summary system healthy indication for all of the controller. The application software uses its variable structures to report a fault problem; these variables give status reports and are configured using the AADvance Workbench software or AADvance-Trusted SIS Workstation software.

　　Faults in the processor modules are none latching. The controller will recover automatically and the fault indication will clear once the fault condition has been removed. Faults in the I/O modules are latched. To clear them a fault reset signal is sent from the processor module by pressing the Fault Reset button on the processor module front panel. Field faults are not latched and will clear as soon as the field fault is repaired.

　　When the Fault Reset button on each processor module is pressed it attempts to clear a fault indication immediately, however, the diagnostic systems will report a serious problem again so quickly there will be no visible change in the fault status indications.

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